Rigid-flexible PCB
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Detail
structure | Multi layer flexible paging or bonding structure, HDI structure |
Layer number | The 2-20 level |
Minimum flexible zone width | 3mm |
Line width / spacing | Inner 3 / 3mil, outer 3.5/3.5mil |
Minimum borehole diameter | 0.10 mm (laser drilling) / 0.15 mm (mechanical drilling) |
Minimum pad width | 4mil |
Hole to conductor spacing | 5MIL for floors 6 and below, 6mil for floors 7 to 11, 8mil for floors 12 and above |
Plate thickness aperture ratio | 1: 1 (blind hole); 16:1 (through hole) |
Dimension accuracy | ± 0.10 mm (special ± 0.05 mm) |
Surface treatment | ENIG、ENEPIG、HASL、FLASH GOLD、HARD GOLD、OSP |
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