Detail
| ITEM | Batch | Remarks | |||
| Conventional process | Unconventional process | ||||
| PCB specification of SMT | L*W | Minimum | L≥50mm | L＜50mm | Including process side |
| W≥50mm | |||||
| Maximum | L≤460mm | L＞460mm | |||
| W≤460mm | W＞400mm | ||||
| Thickness | Thinnest | 0.5mm | T＜0.5mm | ||
| Thickest | 6.0mm | T＞4.5mm | |||
| SMT mount component specifications | Outline size | Minimum specification | 0201 | 01005 | / |
| （0.6mm*0.3mm） | （0.3mm*0.2mm） | / | |||
| Maximum size | 150mm*125mm | 150mm*125mm＜SMD | / | ||
| Component thickness | T≤25mm | 6.5mm＜T≤15mm | / | ||
| QFP, SOP, SOJ, etc | Minimum pin spacing | 0.4mm | 0.3mm≤Pitch＜0.4mm | / | |
| CSP,BGA | Minimum ball spacing | 0.5mm | 0.3mm≤Pitch＜0.5mm | / | |
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