ITEM Batch Remarks
Conventional process Unconventional process
PCB specification of SMT L*W Minimum L≥50mm L<50mm Including process side
Maximum L≤460mm L>460mm
W≤460mm W>400mm
Thickness Thinnest 0.5mm T<0.5mm
Thickest 6.0mm T>4.5mm
SMT mount component specifications Outline size Minimum specification 0201 01005 /
(0.6mm*0.3mm) (0.3mm*0.2mm) /
Maximum size 150mm*125mm 150mm*125mm<SMD /
Component thickness T≤25mm 6.5mm<T≤15mm /
QFP, SOP, SOJ, etc Minimum pin spacing 0.4mm 0.3mm≤Pitch<0.4mm /
CSP,BGA Minimum ball spacing 0.5mm 0.3mm≤Pitch<0.5mm /


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