Detail
ITEM | Batch | Remarks | |||
Conventional process | Unconventional process | ||||
PCB specification of SMT | L*W | Minimum | L≥50mm | L<50mm | Including process side |
W≥50mm | |||||
Maximum | L≤460mm | L>460mm | |||
W≤460mm | W>400mm | ||||
Thickness | Thinnest | 0.5mm | T<0.5mm | ||
Thickest | 6.0mm | T>4.5mm | |||
SMT mount component specifications | Outline size | Minimum specification | 0201 | 01005 | / |
(0.6mm*0.3mm) | (0.3mm*0.2mm) | / | |||
Maximum size | 150mm*125mm | 150mm*125mm<SMD | / | ||
Component thickness | T≤25mm | 6.5mm<T≤15mm | / | ||
QFP, SOP, SOJ, etc | Minimum pin spacing | 0.4mm | 0.3mm≤Pitch<0.4mm | / | |
CSP,BGA | Minimum ball spacing | 0.5mm | 0.3mm≤Pitch<0.5mm | / |
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