Introduction to SMT surface mount process capability
| items | batch | ||||
| Conventional process | Unconventional process | note | |||
| SMT PCB specification | （L*W） | min | L≥50mm | L＜50mm | Including process edge |
| W≥50mm | |||||
| max | L≤460mm | L＞460mm | |||
| W≤460mm | W＞400mm | ||||
| ply（T） | thinnest | 0.5mm | T＜0.5mm | ||
| thickest | 6.0mm | T＞4.5mm | |||
| SMT mount component specification | Overall dimensions | The minimum specifications | 0201 | 01005 | / |
| （0.6mm*0.3mm） | （0.3mm*0.2mm） | / | |||
| maximum size | 150mm*125mm | 150mm*125mm＜SMD | / | ||
| element thickness | T≤25mm | 6.5mm＜T≤15mm | / | ||
| QFP, SOP, SOJ, etc | Minimum PIN spacing | 0.4mm | 0.3mm≤Pitch＜0.4mm | / | |
| CSP,BGA | Minimum ball spacing | 0.5mm | 0.3mm≤Pitch＜0.5mm | / | |
